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Wednesday, 05 Feb 2020 08:00 pm

Breakthroughs Driving Semiconductor Industry

EUV (extreme ultraviolet), a next generation lithography technology will possibly aid chipmakers migrate towards next nodes. However, EUV lithography will not be the solution that can capably address all the challenges of semiconductor industry. Hence, there is a requirement of a few breakthroughs that will fuel the business including memories, packaging, power semis and new architectures.

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Though listing the essential technology breakthroughs is almost impossible, however, there are a few of that the industry must take in to consideration for up scaling their businesses to next level in coming year:

New chip & AI architectures: The industry necessitates an entirely different approach, such as a new playbook, says one of the expert. This new playbook includes new architectures using artificial intelligence (AI), materials, advanced packaging as well as 3D structures.

Innovating AR and VR:  The industry must look towards getting breakthroughs in terms of augmented reality (AR) and virtual reality (VR) that will not only enable simplifies assembly instructions bust also facilitate efficient equipment maintenance as well as increasing productivity. Also, AR and VR breakthroughs will get better-quality work at cost-effective rates.

Developments in advanced packaging: Traditional chip scaling is now considered very difficult and costly, players of the industry must now look in to alternatives like Chiplets (multi-chip module). However, there are still a few challenges that is being faced by industry in advanced packaging.

New power semis: Power semiconductors functions like a switch in high-voltage applications that includes power supplies, automotive, solar & trains. Moreover, the power semis might perhaps boost efficiencies along with minimizing any losses in system.

In addition, power semis based on gallium nitride (GaN) as well as silicon carbide (SiC) can offer promising outcomes to the market players. Owing to their wide-bandgap technologies, which means they are more efficient than any other traditionally used devices. Moreover, both of these two devices have higher field of breakdown & thermal conductivity as compared to other devices.

Although, GaN & SiC power semis are successfully making inroads, but are even facing several challenges.

Tags Artificial Inteligence Augumented Reality Virtual Reality Chiplte Multi-chip module Power Semis Semiconductor Packaging

Neha Pandey

Aware of her elements, Neha writes the best articles across industries including electronics & semiconductors, automotive & transportation and food & beverages. Being from the finance background she has the ability to understand the dynamics of every industry and analyze the news updates to form insightful articles. Neha is an energetic person interested in music, travel, and entertainment. Since past 5 years, she written extensively on sectors like technology, finance and healthcare.


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